2.5 D & 3D Chips: Interposers and Through Silicon Vias
Advantages of 3D/2.5D chips. Challenges in making 3D chips using Through Silicon Via (TSV)
Stanford University's class on nanomanufacturing, led by Aneesh Nainani.
Oct 29, 2012
Week 6, Lecture 11, Part 3
Видео 2.5 D & 3D Chips: Interposers and Through Silicon Vias канала nanolearning
Stanford University's class on nanomanufacturing, led by Aneesh Nainani.
Oct 29, 2012
Week 6, Lecture 11, Part 3
Видео 2.5 D & 3D Chips: Interposers and Through Silicon Vias канала nanolearning
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