Pick + Place and Die Bonding
Комментарии отсутствуют
Информация о видео
Другие видео канала
SMT Pick-and-Place ProcessFuji CP-643 Chip Shooter 500 Placements - PCB AssemblyTRESKY Automation Micro AssemblyEssemtec - Cobra - High speed Pick and Place Product Video HDDecapping ICs (removing epoxy packaging from chips to expose the dies)Adhesives for MEMS Packaging (MEMS / ASIC Die Attach, Cap Bonding, Glob Top)HB75 TPT Die Bonder with Tool RotationITEC-Die Attach 1 bonder Process Integrated LineInfotech - Wafer HandlingACTIVE ALIGNMENT of optical componentsHow a CPU is madeAutomatic die board sawing machine VS laser die cutting machineFINEPLACER lambda 2 - the ultimate tool for opto assembliesDie Attach ProcessesWafer-Level and Single-Die TestingPick and expoy capabilitySparkFun Hot Air Rework with David StillmanSinterstar F XLSPEA - MEMS Test CellVacuum cleaner brush automated assembly line