Decapping ICs (removing epoxy packaging from chips to expose the dies)
I thought it would be interesting to try decapping some chips. This involves using fuming nitric acid, which also seemed fun, so I thought I would give it a go. The process starts by milling a precise pocket into the IC using my CNC machine. I used carbide tooling to cut the glass fiber/epoxy material. I then put a drop or two of the acid into the pocket, and raised the temperature to about 100*C. The acid dissolves the epoxy packaging as it sort of "dries". I added more acid to the pocket every few minutes. After about 10 minutes, I washed the IC in acetone, then reapplied acid if there was still material left on the die. Eventually, it was all cleared away, and I had a nice decapped IC.
Видео Decapping ICs (removing epoxy packaging from chips to expose the dies) канала Applied Science
Видео Decapping ICs (removing epoxy packaging from chips to expose the dies) канала Applied Science
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