[Photolithography Part3] Alignment & Overlay

After diving deep into the world of Lithography, we're back to unravel another complex yet fascinating subject—Alignment & Overlay. In this sequel, we'll take you on a journey through the intricate layers of semiconductor manufacturing, focusing on the critical aspects of overlay error and alignment techniques. We'll kick things off by dissecting the key elements of Overlay Error, such as Scribe Lane, Alignment Mark, and the all-important Total Measurement Uncertainty. We'll also explore a holistic approach to overlay control, breaking down its classification and hierarchy for a comprehensive understanding. Then, we'll venture into the realm of Alignment & Leveling, examining the cutting-edge ASML TwinScan technology and its various phases. We'll guide you through the life cycle of a wafer, touching on specialized topics like UV Level Sensor and Global Leveling Circle. We'll also delve into the role of sensors and marks, discussing their key performance indices. As we wrap up, we'll focus on Overlay, discussing its vectors, terms, and modeling techniques. We'll explore both Linear and Non-Linear models, covering essential metrics and measurement techniques. We'll also discuss Overlay Correction methods and In-Device Metrology topics, concluding with Advanced Process Control methods. Whether you're a seasoned professional or a newcomer to the field, this video aims to deepen your understanding of Alignment & Overlay, a cornerstone in the ever-evolving world of semiconductors. Don't miss out on this comprehensive guide that builds upon our previous exploration of Lithography.

Видео [Photolithography Part3] Alignment & Overlay автора Велоупражнения Эксперт