Combining eMMC & LPDDR For The Most Compact Memory | BIWIN at EW 2024

BIWIN shrinks storage and RAM footprint with ePOP memory for the most compact devices!

Embedded World 2024 is shaping up to be a goldmine for interesting memory devices!

ipXchange was pleased to interview Kevin from BIWIN about some new industrial eMMC ICs and BIWIN’s ePOP (e-Package-On-Package) devices. The latter combines eMMC and LPDDR memory for a streamlined memory solution for the most space-constrained builds!

Watch the full interview on the ipXchange website and learn more about BIWIN’s capabilities to shrink the space required for essential memory so that you don’t have to make unnecessary sacrifices in your product: [link]

Keep designing!

#EW24 #EW2024 #embedded #memory #mobiledevices #wearables #eMMC #LPDDR #RAM #randomaccessmemory #electronics #electronicsengineering #semiconductor #semiconductorpackaging #disruptivetechnology

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Видео Combining eMMC & LPDDR For The Most Compact Memory | BIWIN at EW 2024 канала ipXchange