Inside ADLINK x AMD: AMD® Ryzen™ Embedded COM Innovations at Embedded World 2026

Step back into Embedded World 2026 and explore how open standards are shaping the future of embedded computing. In this session, Richard Pinnow (ADLINK) and David Rosado (AMD) discuss the latest innovations around AMD® Ryzen™ AI Embedded P100 Series Processor- and AMD® Ryzen™ Embedded 8000 Series Processor-based computer-on-modules (COMs) and why standardization and modular design are critical for scalable, secure, future-ready industrial systems.

🔹 Unlocking performance and scalability with AMD® Ryzen™ AI Embedded P100 Series Processor- and AMD® Ryzen™ Embedded 8000 Series Processor based computer-on-modules
🔹 Taking advantage of x86 architecture interoperability and AMD open ecosystem commitment
🔹 Securing supply chains with modular COM architectures
🔹 Designing 24/7 reliable industrial systems

Whether you're designing next-gen edge AI, physical AI, robotics, or industrial automation systems, this discussion offers valuable insight into building flexible, secure and reliable embedded solutions.

Learn more about ADLINK COM Express modules and how they’re shaping the future of embedded edge and physical AI computing:
COM Express｜https://www.adlinktech.com/en/com-express

Видео Inside ADLINK x AMD: AMD® Ryzen™ Embedded COM Innovations at Embedded World 2026 канала ADLINK Technology