Power Module Assembly by Hot Tacking

The production of power modules with the hot tacking process can be carried out in many ways in the DIE bonders from Tresky. The DIE assembly can be done directly from the wafer or the DIEs are picked up from a tray after separation. This tray is fed into the machine via a tray feeder. The DIE is picked up from a defined pick-up position and placed on the substrate.

In the Hot Tacking Process, the components are heated to a specific temperature. The heated components are then brought into contact with each other. Pressure is applied to join them together. This can be done by applying mechanical pressure. After the components are bonded together, they are slowly cooled, stabilizing the bond. This causes the components to remain in their fixed position.

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Видео Power Module Assembly by Hot Tacking канала Tresky GmbH