Fast electronics cooling with ANSYS Icepak - from CAD

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Setting up an electronics cooling problem has become much faster with ANSYS Spaceclaim and ICEPAK. This solves the key challenge of how to handle highly complex CAD geometry and merge it with the best CFD solver available. In addition, special library components can be fully parameterized for design exploration and optimization.
Project file can be found at https://www.singularityeng.com/electronics-cooling

Видео Fast electronics cooling with ANSYS Icepak - from CAD канала Singularity Engineering LLC