RESEARCH SPOTLIGHT: Polymers -Thermal Analysis and Dynamic Mechanical Analysis of Dual Curing Resins

The Polymer Engineering Center utilizes several material characterization techniques across a range of research topics. This presentation will briefly describe how thermal analysis and dynamic mechanical analysis has been used to optimize the manufacturing of dual curing resins systems used in 3D printing, understand how climatic conditions affect oxidative degradation and crystallization in natural rubber, validate processing conditions for aerospace components and understanding the dynamic behavior of elastomers for athletic footwear applications. Specific techniques that will be discussed include, differential scanning calorimetry (DSC), thermogravimetric analysis (TGA), and high-force dynamic mechanical analysis (DMA)

PRESENTED BY
Professor Tim A. Osswald
Consolidated Papers Foundation Chair sponsored by the Mead Witter Foundation
Professor at the Friedrich-Alexander-Universität Erlangen-Nürnberg and Honorary Professor at the Universidad Nacional de Colombia
co-Director of the Polymer Engineering Center, Mechanical Engineering Department, University of Wisconsin-Madison, Madison, WI

Видео RESEARCH SPOTLIGHT: Polymers -Thermal Analysis and Dynamic Mechanical Analysis of Dual Curing Resins канала NETZSCH Instruments North America LLC