HC33-T2.2: Advanced Packaging, Part 2

Tutorial 2, Part 2, Hot Chips 33 (2021), Sunday, August 22, 2021.

Organizer: Ralph Wittig, Xilinx

This tutorial discusses advanced 3D packaging technologies that enable performance and density improvements. Descriptions of the technologies and how they are used in cutting edge applications will be made by industry leaders in packaging and chip design.

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In Part 2, the "case study" segment, Intel and AMD describe how they have used the technologies described in Part 1 to build real products. Finally, the "expert opinion" talk compares the technologies to give some insight for companies that are deciding which ones might be appropriate for them.

Case Study: Intel products built with 2.5D and 3D packaging
Ravi Mahajan & Sandeep Sane, Intel

Case Study: AMD products built with 3D packaging
Raja Swaminathan, AMD

Expert Opinion: An overview of the package technology landscape and industry deployment
Jan Vardaman, TechSearch International Inc

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