CPU on the Back of Motherboard & Huge Passive Heatsink - ENCTEC REV Motherboard Review

This backwards motherboard has the CPU socket on the back side, but keeps the rest of the components in the normal position. It has a reason, and that reason features a huge heatsink.
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The ENCTEC REV motherboard (H110 and B250 variants now, soon Q270 and Z490) is a series of backwards boards that put the socket on the back. This is to enable use in specialized industrial machines that must remain in service for long periods. Those same machines have specific dust mitigation strategies that largely revolve around eliminating fans -- a fine strategy -- except accounting for that heat load requires a passive heatsink that can't fit on the traditional side of the motherboard. This setup allows a motherboard-sized heatsink (the HP-01) to be installed on the back of the motherboard, while add-in cards, RAM, and everything else can remain on the front of the motherboard. ENCTEC is the English name for Taiwanese company "元得," or "Yuan2de2" in Pinyin. ENCTEC's parent company (EDAC) is known for manufacturing surface flatness testing equipment, automated optical inspection equipment, and other tools used in SMT lines.

Watch one of our tours of an SMT Factory here (Gigabyte motherboard factory): https://www.youtube.com/watch?v=cnAFTMaS5R0

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TIMESTAMPS

00:00 - Why this Exists & Where It Came From
04:25 - Background of ENCTEC & EDAC
06:07 - Backwards Motherboards and Huge Passive Heatsinks
08:39 - Case Compatibility Considerations
13:37 - Testing & Importance of Ambient Temperature
15:44 - Active vs. Passive Cooling (Frequency)
17:03 - Thermals for Active vs. Passive Cooling
18:21 - Passive Time-to-Steady State
19:01 - Cool-Down Time Active vs. Passive
21:39 - Conclusion: A Great Mentality & Unique Ideas

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Host: Steve Burke
Editorial, Testing: Patrick Lathan
Video: Keegan Gallick, Andrew Coleman

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