300-mm Fab for Thin Silicon Wafer in Villach | Infineon

'Starting in 2011 Infineon Technologies AG has produced the first chips on a 300-millimeter thin silicon wafer for power semiconductors at the Villach site in Austria. This makes Infineon the first company in the world to succeed in taking this step forward.

The chips produced on a 300-millimeter thin wafer exhibit the same behavior as the power semiconductors made on 200-mm silicon wafers – as has been demonstrated by successful application tests using Metal Oxide Semiconductor Field-Effect Transistors (MOSFETs) for High Voltage applications.

Watch our video and see how Infineon has realized a fully automated 300-mm fab for thin silicon wafer in Villach. A milestone in the history of European industry.

Find more information about 300-mm thin silicon wafer technology for power semiconductors: https://www.infineon.com/cms/en/about-infineon/press/press-releases/2011/INFXX201110-002.html
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Видео 300-mm Fab for Thin Silicon Wafer in Villach | Infineon канала Infineon Technologies AG