Semiconductor Inspection & Metrology for Fabs to Increase Yield and Throughput

Interview with Dr. Subodh Kulkarni, President and CEO, CyberOptics highlights new ways Semiconductor FABs can improve yields and throughput with New 3 micron NanoResolution MRS Sensor for Inspection and Metrology for wafer-level and advanced packaging applications. Also, for the front-end of the Semi FAB tools, our WaferSense wireless measurement devices measure and monitor various applications such as leveling and vibration, can speed semiconductor tool set-up, stabilization, standardization for improved tool uptime and yields.

Видео Semiconductor Inspection & Metrology for Fabs to Increase Yield and Throughput канала CyberOpticsCorp