Backside Power Delivery: The Hidden Revolution in Chips

As chips continue to shrink beyond 3nm, traditional front-side power delivery is hitting its limits.
Backside Power Delivery (BSPDN) — also known as PowerVia (Intel) or Super Power Rail (TSMC) — is a breakthrough technology that supplies power from the back of the chip.

By separating power and signal layers, BSPDN reduces wiring congestion, minimizes power loss, and dramatically boosts both performance and efficiency.
This innovation is now considered essential for next-generation semiconductors, paving the way for the AI era and ultra-dense chip designs.

Discover how Intel and TSMC are racing to implement this hidden revolution in chip design.
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Видео Backside Power Delivery: The Hidden Revolution in Chips канала NEO Tech Global