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SEI LASER PaperOne 5000, flexible system with fast set-up for the packaging industry

SEI Laser PaperOne 5000
The first modular laser system for die-cutting and creasing for the packaging and graphic arts sectors.

Laser cutting with SEI's PaperOne efficiently and consistently cuts complex patterns in paper, cardboard, adhesive-coated, PP, BOPP and PET stocks. Die-cut, micro perforate, pierce and engrave one or a batch of packages, greetings, literature, envelopes and more with pinpoint accuracy. For inline operation, integrate the PaperOne with the HP Indigo 10000, 30000 or virtually any digital press.

Printing, Packaging, Converting and Security/RFID
European Equipment Supplier
Sold & Serviced by Matik, Inc.
Distributor in USA, Canada and Mexico
www.matik.com

Видео SEI LASER PaperOne 5000, flexible system with fast set-up for the packaging industry канала Matik, Inc.
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Информация о видео
29 августа 2015 г. 2:01:50
00:09:05
Яндекс.Метрика