Holst Centre Revolutionizes Micro Component Transfer at DisplayWeek using Precision Laser Technology

Holst Centre in the Netherlands introduced their development for laser D transfer of micro components, emphasizing its precision and non-contact nature. They present a technology utilizing a proprietary release tag combined with a low Co Laser Source to achieve selective transfer of components through the air with a precision of one micron laterally and under one degree. The components they deal with can vary in size, from as small as 10 x 10 microns, and can exhibit arbitrary shapes and aspect ratios. High selectivity allows them to transfer one die on demand without disturbing neighboring components, even on high-density wafers with minimal edge-to-edge spacing.

While their current focus is on transfer, they envision applications like displays. However, they note that transfer alone isn't sufficient for functional displays; bonding is necessary. They aim to disrupt the conventional thermal compression bonding method with flip chip bonding in combination with wire interconnects. This approach promises high throughput, precision, and non-contact operation, which is crucial for achieving full-color displays and facilitating repairs without the need for redundancies.

Their technology addresses the challenge of faulty components during mass transfer, which is typically solved with redundancies in contact-based methods. By incorporating non-contact transfer and repair capabilities, they ensure a 100% yield, making micro displays potentially more affordable in the future. Their discussions with industry professionals at the show revolve around the distinguishing factors of their technology, including high selectivity, the use of a low-cost laser source, and high accuracy compared to existing micro-LED technologies.

They highlight the uniqueness of their approach, which combines a precise laser source with their proprietary release tag to gently release and transfer micro components with accuracy. They emphasize that their technology isn't limited to specific materials or surface treatments and can be applied to various electronics, including photonics. They demonstrate the ability to transfer components with complex shapes and high aspect ratios accurately, enabling applications previously unattainable with traditional pick-and-place methods.

The focus on component miniaturization is essential, targeting components that are too small or have awkward shapes for pick-and-place methods. Their technology opens up possibilities for transferring components that were previously challenging or impossible to handle. While their process requires post-processing and compatibility checks with different devices, it demonstrates compatibility with standard semiconductor devices and micro LEDs.

Their R&D tool prototype showcases the working principle, featuring a laser source aligned with donor and receiver plates to enable precise transfer with a customizable gap. Despite their participation not being driven by competition, they express confidence in their technology's capabilities. Their objective is to showcase their innovation rather than aiming for awards, emphasizing the collaborative spirit of the event.

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